Semiconductor launch
NMIS hosts R&D facility to boost chip supply

An R&D development that will help accelerate the production and supply of computer chips will open in Scotland this year.
The advanced packaging line, to be located at at the National Manufacturing Institute Scotland (NMIS) at Inchinnan, Renfrewshire, will be the first in Europe and takes a key stage in semiconductor manufacturing to the next level.
Packaging protects core components and readies them for use in a range of technologies. The UK’s semiconductor packaging market, valued at £500 million and employing 15,000 people, is projected to reach £750m by 2030, with the NMIS facility set to accelerate growth.
The Inchinnan facility, which has received £9 million from Innovate UK, will reduce packaging times for UK firms from months to just days. The facility forms part of the University of Strathclyde’s Advanced Net Zero Innovation Centre (ANZIC).
Martin McHugh, chief executive at the Compound Semiconductor Applications (CSA) Catapult, said: “This new facility will allow semiconductor and packaging companies to try and test new ideas, helping to de-risk the commercialisation process and bring their products and solutions to market quicker.
“This transformation of ideas into products will be the key to unlocking the full growth potential of the UK’s semiconductor industry, helping to further develop our world-leading strengths in advanced packaging across a range of industries.”
Professor Matt Boyle, director of electrification at NMIS, said: “At the NMIS we work with manufacturers of all sizes to help them boost productivity and efficiency and we’re excited to help grow the semiconductors supply chain here in the UK and secure a lead in sector innovation.
“The new packaging line unlocks the potential to reshore manufacturing to the UK.
“This is just the beginning – our aim is to accelerate semiconductor manufacturing, allowing companies to explore new technologies and implement testing without disrupting day-to-day production.”
Professor Sir Jim McDonald, principal and vice-chancellor of the University of Strathclyde, said the initiative will strengthen the UK’s semiconductor supply chain and accelerate the journey towards net zero.










